Chemical Mechanical Planarization

SCP006 - 8.00 Hours

Description

The CMP seminar provides an excellent overview of the purpose of CMP, introduction to the common tools and reviews the consumables in the CMP process. Issues related to planarization or polishing of dielectric materials and conductors, post CMP clean-up and metrology are also discussed. Also, issues related to the polishing pad conditioning, techniques used to maintain uniformity, polishing depth and postpolish cleaning are discussed. Download our in-depth course description.

This course can be scheduled to meet your specific needs. For more information about this course or to schedule a class for your organization, please contact Knowledge Engineering at (800) 541-7149 or ke@teex.tamu.edu.

Description

The CMP seminar provides an excellent overview of the purpose of CMP, introduction to the common tools and reviews the consumables in the CMP process. Issues related to planarization or polishing of dielectric materials and conductors, post CMP clean-up and metrology are also discussed. Also, issues related to the polishing pad conditioning, techniques used to maintain uniformity, polishing depth and postpolish cleaning are discussed. Download our in-depth course description.

Prerequisites

There are no prerequisites for this course.

Topics

CMP of dielectrics +CMP of metals +Consumables +Equipment fundamentals +Metrology +Post CMP clean-up +Process description +Process parameters

Suggested Audience

  • Experienced wafer fab equipment operators
  • Equipment technicians
  • Entry-level engineers
  • New fab supervisors
  • New fab managers
  • Professional fab support personnel

Other Information

Please call customer service at 1-800-541-7149 for more information or email us at ke@teex.tamu.edu

Contact Information

Knowledge Engineering
Phone: (979) 458-6710 | Tollfree: (800) 541-7149

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